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   MBR5H100MFS, NRVB5H100MFS http://onsemi.com 2 THERMAL CHARACTERISTICS Characteristic Symbol Typ Max Unit Thermal Resistance, Junction?to?Case, Steady State (Assumes 600 mm2 1 oz. copper bond pad, on a FR4 board) RθJC ? 2.4 °C/W ELECTRICAL CHARACTERISTICS Instantaneous Forward Voltage (Note 1) (iF = 5 Amps, T J = 125 °C) (iF = 5 Amps, T J = 25 °C) vF 0.56 0.6 0.6 0.73 V Instantaneous Reverse Current (Note 1) (Rated dc Voltage, TJ = 125 °C) (Rated dc Voltage, TJ = 25 °C) iR 3 0.003 13 0.1 mA 1. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤ 2.0%. |